Advanced Process Systems, is committed to providing next generation manufacturing equipment for product development through full production in the semiconductor development areas of MEMS, WLP, MCM, 3-D advanced packaging, compound semiconductor, chemical mechanical planarization and many diverse areas of advanced packaging. Representing cost effective equipment for R&D through production in the manufacturing areas of  Chemical Mechanical Planarization (CMP), Our R&D Contract center for Chemical Mechanical Planarization provides complete client support of the latest technology's in Chemical Mechanical Planarization and provides the most multi-disciplinary staff of scientist, engineers and mechanical engineers of any R&D center in the United States.